1 features applications description/ordering information tpd4e004 4-channel esd-protection array for high-speed data interfaces slvs729a ? february 2008 ? revised february 2008 www.ti.com 2 esd protection exceeds jesd usb ? 15-kv human-body model (hbm) ethernet ? 8-kv iec 61000-4-2 contact discharge firewire ? 12-kv iec 61000-4-2 air-gap discharge video low 1.6-pf input capacitance cell phones 0.9-v to 5.5-v supply voltage range svga video connections 4-channel device glucose meters space-saving son (dry) package the tpd4e004 is a low-capacitance 15-kv esd-protection diode array designed to protect sensitive electronics attached to communication lines. each channel consists of a pair of diodes that steers esd current pulses to v cc or gnd. the tpd4e004 protects against esd pulses up to 15-kv human-body model (hbm), 8-kv contact discharge, and 12-kv air-gap discharge, as specified in iec 61000-4-2. this device has a 1.6-pf capacitance per channel, making it ideal for use in high-speed data io interfaces. the tpd4e004 is a quad-esd structure designed for usb, ethernet, and other high-speed applications. the tpd4e004 is available in the dry package and is specified for ? 40 c to 85 c operation. ordering information t a package (1) (2) orderable part number top-side marking son ? dry ? 40 c to 85 c (1.0 mm 1.45 mm, reel of 5000 TPD4E004DRYR 2p pitch = 0.5 mm, height = 0.55 mm) (1) package drawings, thermal data, and symbolization are available at www.ti.com/packaging . (2) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti website at www.ti.com . 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 2008, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. dry package (top view) io1 6 4 3 io4 5 2 io2 gnd v cc 1 io3
absolute maximum ratings (1) tpd4e004 4-channel esd-protection array for high-speed data interfaces slvs729a ? february 2008 ? revised february 2008 pin description terminal description name no. gnd 3 ground iox 1,2,4,5 esd-protected channel v cc 6 power-supply input over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range ? 0.3 5.5 v v io input/output voltage range ? 0.3 v cc + 0.3 v t stg storage temperature range ? 65 150 c t j junction temperature 150 c infrared (15 s) 220 bump temperature (soldering) c vapor phase (60 s) 215 lead temperature (soldering, 10 s) 300 c (1) stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum-rated conditions for extended periods may affect device reliability. 2 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpd4e004 www.ti.com io3 io4 gnd io2 io1 v cc
electrical characteristics esd protection tpd4e004 4-channel esd-protection array for high-speed data interfaces slvs729a ? february 2008 ? revised february 2008 v cc = 0.9 v to 5.5 v, t a = t min to t max (unless otherwise noted) parameter test conditions min typ (1) max unit v cc supply voltage 0.9 5.5 v i cc supply current 500 na v f diode forward voltage i f = 1 ma 0.8 v i i channel leakage current 1 na v br break-down voltage i i = 10 m a 6 8 v c i/o channel input capacitance v cc = 5 v, bias of v cc /2, f = 10 mhz 1.6 2 pf (1) typical values are at v cc = 5 v and t a = 25 c. parameter typ unit hbm 15 kv iec 61000-4-2 contact discharge 8 kv iec 61000-4-2 air-gap discharge 12 kv copyright ? 2008, texas instruments incorporated submit documentation feedback 3 product folder link(s): tpd4e004 www.ti.com
typical operating characteristics tpd4e004 4-channel esd-protection array for high-speed data interfaces slvs729a ? february 2008 ? revised february 2008 figure 1. forward diode voltage (upper clamp diode) figure 2. leakage current vs temperature (v io = 2.5 v) (v cc = 0 v, dc sweep across the io pin) figure 3. reverse diode curve current io to gnd figure 4. io capacitance vs input voltage (v cc = open) (v cc = 5 v) 4 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpd4e004 www.ti.com 0 20 40 60 80 100 120 140 160 1.05 1.15 1.25 1.35 1.45 1.55 io voltage (v) io current (ma) 0 10 20 30 40 50 60 70 ?40 25 55 85 temperature (c) leakage current (pa) 1 2 3 4 5 io voltage (v) 0.0 1.0 2.0 3.0 4.0 5.0 io capacitance (pf) 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 io voltage (v) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 io current (a)
tpd4e004 4-channel esd-protection array for high-speed data interfaces slvs729a ? february 2008 ? revised february 2008 typical operating characteristics (continued) figure 5. iec esd clamping waveforms +8-kv contact copyright ? 2008, texas instruments incorporated submit documentation feedback 5 product folder link(s): tpd4e004 www.ti.com ?20 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 time (ns) amplitude (v)
application information detailed description tpd4e004 4-channel esd-protection array for high-speed data interfaces slvs729a ? february 2008 ? revised february 2008 when placed near the connector, the tpd4e004 esd solution offers little or no signal distortion during normal operation due to low i/o capacitance and ultra-low leakage current specifications. the tpd4e004 ensures that the core circuitry is protected and the system is functioning properly in the event of an esd strike. for proper operation, the following layout/design guidelines should be followed: 1. place the tpd4e004 solution close to the connector. this allows the tpd4e004 to take away the energy associated with esd strike before it reaches the internal circuitry of the system board. 2. place a 0.1- m f capacitor very close to the v cc pin. this limits any momentary voltage surge at the io pin during the esd strike event. 3. make sure that there is enough metallization for the v cc and gnd loop. during normal operation, the tpd4e004 consumes na leakage current. but during the esd event, v cc and gnd may see 15 m a to 30 m a of current, depending on the esd level. sufficient current path enables safe discharge of all the energy associated with the esd strike. 4. leave the unused io pins floating. 5. the v cc pin can be connected in two different ways: a. if the v cc pin is connected to the system power supply (a 0.1- m f capacitor at v cc is recommended for esd bypass), the tpd4e004 works as a transient voltage suppressor for any signal swing above v cc + v d . b. if the v cc pin is not connected to system power supply (a 0.1- m f capacitor is still recommended at the v cc pin for esd bypass), the tpd4e004 can tolerate higher signal swing in the range up to v br . note that initially the bypass capacitor is charged by the signals through clamp diode. 6 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpd4e004 www.ti.com io3 io4 gnd io2 io1 0.1 f v cc usb controller r t v bus d+d? gnd v bus d+d? gnd
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) TPD4E004DRYR active son dry 6 5000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim TPD4E004DRYRg4 active son dry 6 5000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 8-oct-2008 addendum-page 1
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TPD4E004DRYR son dry 6 5000 179.0 8.4 1.2 1.65 0.7 4.0 8.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TPD4E004DRYR son dry 6 5000 220.0 205.0 50.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2
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products www.dlp.com broadband www.ti.com/broadband dsp dsp.ti.com digital control www.ti.com/digitalcontrol clocks and timers www.ti.com/clocks medical www.ti.com/medical interface interface.ti.com military www.ti.com/military logic logic.ti.com optical networking www.ti.com/opticalnetwork power mgmt power.ti.com security www.ti.com/security microcontrollers microcontroller.ti.com telephony www.ti.com/telephony rfid www.ti-rfid.com video & imaging www.ti.com/video rf/if and zigbee? solutions www.ti.com/lprf wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2009, texas instruments incorporated
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